NXP Announces GreenChip for Low-Cost LED Lamps up to 10W
Source/Type: Solid State Lighting Design LED Lighting News - Press Releases - As issued by company

June 8, 2012... Non-dimmable SSL2115x series to drive energy-efficient LEDs

Eindhoven, Netherlands and Shanghai, China--NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the SSL2115x series of high-efficiency GreenChip™ driver ICs for low-cost LED retrofit lamps. The new SSL21151 and SSL21153 are designed for non-dimmable 5W and 10W LED lamps respectively, providing good current control in flyback and buck-boost configurations. The SSL2115x enables small form-factor LED drivers, using primary-side sensing to regulate current, and offering integrated LED open/short protections, an internal 700V MOSFET, and a circuit enabling start-up directly from the rectified mains voltage. With the use of an additional valley fill circuit, the SSL2115x series can offer a power factor of approximately 0.9. NXP is showing the SSL21151/53 at Guangzhou International Lighting Exhibition (Hall 13.2, Booth B43).

“To make LED lamps a viable replacement for incandescent light bulbs on a large scale, many manufacturers are exploring ways to bring the average selling price below the $10 mark. At the same time, the luminous efficacy of LEDs is improving steadily, requiring less power to emit more lumens,” said Ryan Zahn, general manager, lighting solutions product line, NXP Semiconductors. “By offering a compact, low-cost solution for driving LED lamps up to 10W, we are broadening our portfolio of options for lighting manufacturers focused on delivering both energy savings and value to a broad customer base worldwide.”

Features
The new SSL2115x series driver ICs are designed for ultra-low-cost, non-dimmable LEDs using isolated flyback and non-isolated buck-boost topologies, powering up to 5W (SSL21151) and 10W (SSL21153), with a small PCB footprint. Key features include:
· Low output ripple ˂1%
· Power factor (PF): 0.6 or ~0.9 using valley fill
· Internal protections, including over-temperature protection (OTP), LED short protection, LED open protection, and undervoltage lockout protection (UVLO)
· Integrated 700V MOSFET
· Primary-side sensing without an optocoupler
· Low component count, with a complete application requiring only 25 components and fitting in GU10 casing
· Compatibility with IEC 61000-3-2 Harmonics Standards
· EMC compliance: Class B CISPR22 and FCC Part 15
· Compact SO7 package

Availability
Qualification samples of the GreenChip SSL21151 and SSL21153 driver ICs for high-performance non-dimmable LED applications are now available for ordering, with volume production scheduled to begin in July 2012.

Links
SSL21151 product information: http://www.nxp.com/pip/SSL21151T
SSL21153 product information: http://www.nxp.com/pip/SSL21153T
SSL2115x data sheet: http://www.nxp.com/documents/data_sheet/SSL2115X.pdf
· GreenChip SSL products from NXP: http://www.nxp.com/greenchip/ssl

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.

- ENDS -

Forward-looking Statements

This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP’s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP’s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers’ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP’s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP’s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.


For further press information, please contact:
Global: Eureka Endo
+44 795 828 7483
eureka.endo@nxp.com
GC : Jannet Chen
+86 21 22055883
jannet.chen@nxp.com

NA: Allen Tsai
+1 415 593 8449
allen.tsai@text100.com
APAC: Lilian Li
+86 21 22052615
lilian.li@nxp.com

See the Current Industry News Summary
See this article in its orginal context, with the other current news from the same week